-
-
Fireproof and explosion-proof junction box
When you select explosion-proof junction boxes for hazardous zones, safety must come first. You need to match the box to the environment and check all relevant standards. They are commonly made of aluminum, stainless steel, or heavy-duty cast metals. Pepperl+Fuchs provides a specialized portfolio of Ex d (flameproof) and Ex tb (dust protection by enclosure) certified terminal boxes and junction boxes engineered for reliable use in explosion-hazardous areas. Unlike standard junction boxes, it is built with reinforced materials and sealed construction to withstand internal explosions without allowing flames or sparks to escape. Certified to ATEX and IECEx standards, these enclosures are essential for use in industries such as petrochemical, offshore, and manufacturing, where flammable gases or. -
-
-
-
-
-
Israeli Tunable Optical Module 40G
T1-QSFP-40G-DWDM-C-XX's pluggable optical transceiver modules are designed for multiple 40GE links up to 80km distance over standard G. 652 single-mode optical fibers (SMF). several kilometers, no EDFA and dispersion compensation modules (DCM). FS 40G QSFP+ optical transceiver module solutions offer a full range of QSFP+ modules from 150m to 80km reach, and used for high-density switching, routing and data center applications. Lumentum offers the broadest range of tunable transmission products including a narrow linewidth integrable tunable laser assembly (ITLA), a 40G and 100G intradyne coherent receiver (ICR), a 40G DP-QPSK coherent transponder, and a wide range of tunable XFP and world-leading tunable SFP+ products. -
Potential of AI Server Power Chips
This blog post explores innovations in power devices, gate drivers and advanced controllers with Digital Signal Processing (DSP) capabilities to meet Artifical Intelligence (AI) servers' power and efficiency needs. The rise of artificial intelligence (AI) has significantly increased computing. As AI proliferates, the extreme power demanded by processors such as NVIDIA's Grace Hopper H100 super-chip require a two- or three-fold increase - from around 30 to 40 kW per cabinet in current servers to 100 kW or more. There are physical considerations too. The space afforded to power. Frank Long is a vice president at the Goldman Sachs Global Institute, where he focuses on AI. Packing processors closer together creates significant performance and cost improvements for both training and inference workloads. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal. A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure, cooling systems, and power grids to breaking point. In collaboration with NVIDIA, Infineon will develop the next generation of power systems based on a new architecture with centralized power generation through 800V high-voltage direct current. -
